| 制程能力及檢測參數 Process capability and checking parameters | ||||||||
| ITEM | Technical capabilities | |||||||
| 層次 Layers | 2-64layers | |||||||
| 最大尺寸 Max.Board Size | 1200mm*610mm | |||||||
| 79"*24" | ||||||||
| 板厚 Finished Board Thickness | 0.15mm--10.0mm | |||||||
| 0.01"--0.4" | ||||||||
| 銅厚 Finished?Copper?Thickness | 17um-420um | |||||||
| 0.5OZ--12OZ | ||||||||
| 最小線(xiàn)寬/線(xiàn)距 Min.Trace Width/Space | 0.075mm/0.065mm | |||||||
| 0.003"/0.0026" | ||||||||
| 最小孔徑 Min.Hole Size | 0.1mm | |||||||
| 0.006" | ||||||||
| PTH孔孔徑差 Hole Dim. Tolerance(PTH) | ±0.05mm | |||||||
| ±0.002" | ||||||||
| NPTH孔孔徑差 Hole Dim.Tolerance(NPTH) | ±0.05mm | |||||||
| ±0.002" | ||||||||
| 孔位公差 Drill Location Tolerance | ±0.05mm | |||||||
| ±0.002" | ||||||||
| V-CUT角度 V-Score Degrees | 20-90度 | |||||||
| / | ||||||||
| 最小V-CUT板厚 Min.V-Score PCB Thickness | 0.25mm | |||||||
| 0.01" | ||||||||
| 外型公差 CNC Routing Tolerance | ±0.1mm | |||||||
| ±0.004" | ||||||||
| 最小盲/埋孔 Min.Blind/Buried Via | 0.1mm | |||||||
| 0.0039" | ||||||||
| 塞孔 Plug Hole Size | 0.2mm--0.5mm | |||||||
| 0.008"--0.02" | ||||||||
| 最小BGA Min.BGA PAD | 0.2mm | |||||||
| 0.008" | ||||||||
| 材質(zhì) Materials | FR4板（指定品牌物料：如建滔、生益、聯(lián)茂、南亞、臺光臺耀等)、高頻板、鐵氟龍板、陶瓷板、羅杰斯板等等 | |||||||
| FR4 (designated brand materials: such as KB, Shengyi, ITEQ, NANYA, EMC,CENS and so on), high frequency board, Teflon board, ceramic board, Rogers board and so on | ||||||||
| 表面處理 Surface Finish | 沉金/防氧化/鍍金 (軟/硬) /噴錫/沉銀沉錫/鍍錫/碳油/金手指 | |||||||
| immersion gold/OSP/plating Gold (soft/hard) /hot air leveling (HASL)/immersion Silver/immersion Tin/plating Tin/Carbon ink/Gold-finger | ||||||||
| 翹曲度 Warp&Twist | ≤0.75% | |||||||
| 通斷測試 Electrical Testing | 50--300V | |||||||
| 可焊性試驗 Solderability Testing | 245±5℃,3sec Wetting area least95% | |||||||
| 熱沖擊試驗 Thermal Cycling Testing | 288±5℃,10sec,3cycles | |||||||
| 離子污染測試 Ionic Contamination Testing | Pb,Hg,Cd,Cr(VI),PBB,PBDE六項均小等于1000ppm | |||||||
| Pb,Hg,Cd,Cr(VI),PBB,PBDE?six items are less than 1000ppm | ||||||||
| 附著(zhù)力測試 Soldmask Adhesion?Testing | 260℃+/-5,10S，3times | |||||||
特殊工藝 Special Technology | 半孔、高Tg板、混合壓板、無(wú)鹵素板、超薄超厚板、邦定、阻抗、藍膠、碳油、電厚金、鎳鈀金、金手指、盲鑼、埋盲孔、沉頭孔、樹(shù)脂塞孔、軟硬結合板、HDI等. | |||||||
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135-3081-9739
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